Smart Tangibles News Digest - Issue #2603 examines how Edge AI has moved from slideware to silicon. This Smart Tangibles News Digest covers Infineon’s PSoC Edge MCUs with built in AI and PSA Level 4 security, MediaTek’s domain specific IoT platform for smart retail, Silicon Labs’ push into AI enabled meters and electronic shelf labels, fresh forecasts putting edge AI on an 8x growth path, and a 2026 Matter status review that shows real progress - and lingering platform fricti

Our CES 2026 Smart Tangibles Digest breaks down the real signals behind the noise in Las Vegas: Matter everywhere, ultra-low-power edge AI, smarter and more secure home entry, and new connected toys and wall panels. Learn what these announcements mean for IoT product strategy, interoperability, and long-lived business models in the smart home and built environment.

Smart Tangibles News Digest - Issue #2601 examines how connected hardware is entering an operability phase. From digital twins becoming operational control planes and sensor-as-a-service models, to on-device AI, fleet governance requirements, and ServiceNow’s acquisition of Armis, this issue highlights how lifecycle control, security integration, and governance are reshaping IoT products, platforms, and procurement decisions in 2026.

This year’s Smart Tangibles Digest reviews the most consequential IoT shifts of 2025. From interoperability and security moving into execution, to hybrid connectivity, scalable 5G RedCap, and edge AI reaching the MCU layer, Issue #2508 highlights how the foundations for operational, long-lived connected products solidified over the year.

This week’s Smart Tangibles Digest examines how the connected-hardware stack is becoming more productizable. From brokers absorbing storage and standards upgrades improving fleet economics, to edge AI platforms gaining long-term OS support and deployable form factors, Issue #2507 highlights the operational maturity shaping scalable, service-led IoT products.

This week's digest signals a shift in IoT from “connected” devices to “operational” systems. IoT stacks are now judged less by feature checklists and more by autonomy, resilience, deployability, and service-backed distribution - how well they run independently, survive real-world failures, and integrate smoothly across environments.

Digital twins, edge AI, sensor-as-a-service, AI-ready MCUs, and software-defined buildings. This week’s Smart Tangibles Digest maps the key shifts shaping next-generation connected products.

Here’s this week’s Smart Tangibles digest - focused on product strategy for connected hardware, IoT, Policy, UX, and Manufacturing.

Here’s this week’s Smart Tangibles digest - focused on product strategy for connected hardware, IoT, Policy, UX, and Manufacturing.

Here’s this week’s Smart Tangibles digest - focused on product strategy for connected hardware, IoT, Policy, UX, and Manufacturing.