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Smart Tangibles News Digest #2507

  • Writer: Yoel Frischoff
    Yoel Frischoff
  • Dec 22, 2025
  • 6 min read

Updated: Jan 5

Issue 2507: December 22, 2025 - The Future of Smart Hardware


A satellite image of the earth
Global Smart Tangibles News from around the world (Image credit: NASA)

Welcome to your weekly review of global smart tangibles. This digest covers connected hardware, IoT infrastructure, edge intelligence, standards, and the business models behind long-lived products.


The Stack is Getting More Productizable


This week’s digest highlights a significant trend: the stack is quietly becoming more “productizable.” The biggest shifts we see are not about new features. Instead, they focus on fewer seams. Brokers are absorbing storage, standards upgrades are translating into better latency and fleet economics, and edge AI platforms are gaining the OS support and packaged form factors necessary to turn prototypes into deployable systems.


The common thread here is operational maturity. This maturity reduces integration friction, improves reliability at scale, and makes service-led business models easier to run.


Cross-Cutting Signals


Looking across this week’s items, several patterns emerge that cut across technologies, vendors, and verticals:


  • The stack is collapsing upward. Brokers are absorbing storage, platforms are bundling analytics, and packaged edge systems are pointing to fewer layers and integration seams. Complexity is shifting from custom architecture to managed platforms.

  • Standards are doing real work again. Bluetooth and LoRaWAN updates are no longer just academic. They directly affect latency, capacity, energy use, and fleet economics. Standards evolution is now a product-level concern, not just an engineering one.

  • Edge AI is becoming operational, not experimental. With OS support, long-term maintenance, and deployable hardware form factors, we are witnessing a shift from demos to fleets. The question has changed from “Can we run AI at the edge?” to “Can we operate it for years?”

  • Lifecycle thinking is baked into infrastructure choices. Announcements increasingly emphasize maintainability, upgrades, and longevity. This reflects a broader move toward service-led models where products are expected to evolve continuously after deployment.

  • Product advantage is moving to the seams. Differentiation increasingly comes from how well components, platforms, and standards fit together, rather than from any single breakthrough feature.


Together, these signals suggest a market moving from exploration to execution. The foundations for scalable, service-driven connected products are solidifying.



This Week at a Glance


Here’s a concise look at the developments shaping connected hardware strategy as the year wraps up.


  • EMQ collapses broker and storage into a single IoT surface.


  • Bluetooth 6.2 improves latency and resilience at the spec level.


  • Ubuntu goes GA on Qualcomm Dragonwing for industrial edge AI.


    Ubunbtu on Dragonwing

  • LoRaWAN boosts capacity with a Regional Parameters update.



  • e-con Systems launches a Jetson Orin NX vision box for production fleets. Link

    NVIDIA Jetson Orin

News In Detail


1. EMQ Ships “Storage in the Broker” with EMQX Tables (GA)


EMQ announced the general availability of EMQX Tables, a time-series database integrated directly into EMQX Cloud. This architectural change means telemetry ingestion, stream processing, and persistence now live inside the broker itself.


This integration reduces operational complexity by collapsing multiple infrastructure layers into one security and scaling model. For product teams, it shortens the path from device data to insights, alerts, and roadmap decisions. It also makes “data as a product” easier to operationalize.


Signals to Watch

  • IoT platforms absorbing adjacent infrastructure layers.

  • Fewer bespoke pipelines between device data and product analytics.

  • MQTT evolving from transport into an application backbone.


Key Links


2. Bluetooth Core 6.2 Enhancements


The Bluetooth SIG released Bluetooth Core 6.2, introducing enhancements aimed at more responsive interaction and stronger robustness in real-world RF environments. This includes changes that affect LE responsiveness and channel-sounding resilience.



  • Shorter Connection Intervals: The minimum LE connection interval drops from 7.5 ms to 375 µs (a 20× improvement). This makes Bluetooth responsive enough for gaming peripherals, real-time controls, and fast sensors where milliseconds matter.

  • Channel Sounding Attack Resilience: This update hardens the secure ranging feature against specific attacks that manipulate signal amplitude to fool distance measurements. This is crucial for keyless car entry and presence detection.

  • HCI USB Isochronous Support: This standardizes how time-sensitive audio streams (LE Audio) are passed over USB between a Bluetooth controller and its host. It removes implementation guesswork for USB-connected Bluetooth audio devices.

  • LE Test Mode Enhancements: This modernizes RF testing by enabling over-the-air tests instead of requiring physical cable connections. This makes compliance and manufacturing testing simpler and more future-proof.


These are spec-level updates, but they directly map to product outcomes: perceived latency, connection stability, and the viability of Bluetooth for higher-stakes device classes and denser deployments.


Signals to Watch

  • Connectivity specs increasingly shaping UX.

  • Bluetooth becoming more viable for mission-critical use cases.

  • Latency and resilience moving from “nice-to-have” to core requirements.


Key Links


3. Ubuntu on Qualcomm Dragonwing IQ-9075


Canonical announced general availability of Ubuntu on Qualcomm Dragonwing IQ-9075, positioning it as a production-grade platform for industrial edge AI deployments. This includes long-term maintenance and enterprise lifecycle support via Ubuntu Pro.

Ubunbtu on Dragonwing


The practical signal here is that edge compute is becoming less bespoke. When silicon vendors and OS vendors align on support, updates, and lifecycle guarantees, it becomes easier to deploy fleets that stay secure and maintainable for years.


Signals to Watch

  • OS lifecycle guarantees becoming a differentiator in edge hardware.

  • Edge AI moving closer to IT governance and patch discipline.

  • Lower friction from pilot deployments to production rollouts.


Key Links


4. LoRaWAN Regional Parameters Update


The LoRa Alliance released RP2-1.0.5 Regional Parameters, introducing new data rates and changes aimed at improving scalability and reducing time-on-air. This update claims to triple LoRaWAN’s highest data rate.



This type of standards progress improves fleet economics quietly. We see higher throughput, better capacity under contention, and improved energy efficiency without forcing a “rip and replace” on device makers.


Signals to Watch

  • Standards bodies optimizing for capacity and TCO, not novelty.

  • LPWAN staying relevant through incremental evolution.

  • Network economics becoming central to IoT business models.


Key Links


5. e-con Systems Launches Darsi Pro


e-con Systems announced Darsi Pro, a Jetson Orin NX-based edge AI compute box aimed at multi-camera vision and robotics workloads. They explicitly frame it as deployable hardware rather than a developer bench system.

NVIDIA Jetson Orin


The bigger signal is that “deployable edge AI” is becoming more repeatable. We see standardized compute blocks paired with fleet-oriented assumptions like reliability, integration readiness, and lifecycle operations.


Signals to Watch

  • Vision and robotics stacks shifting from custom builds to packaged modules.

  • Edge AI hardware increasingly sold with operational deployment in mind.

  • Jetson consolidating as a standard building block for industrial AI.


Key Links


From TheRoad / Smart Tangibles


  • Latest digest: If you missed it, last week’s [News Digest Issue #2506] covered the shift from “connected” to “operational.” IoT stacks are now being judged by autonomy, resilience, deployability, and service-backed distribution more than by feature checklists.

  • Smart Tangibles book progress: The Smart Tangibles manuscript is currently expanding its chapters on connectivity standards and security baselines for smart products. If you have a case study that touches on Matter, Thread, Zigbee, or IoT security labels, I would love to hear from you via the [Smart Tangibles case submission page].



How to Use This Digest


This digest is designed to be more than a news summary. Use it as a strategic signal scan.


  • Product leaders - Look for shifts that reduce integration friction or change build vs. buy decisions. Items like broker-native storage or OS-level edge support often signal when platforms are ready for productization, not just pilots.

  • Hardware and IoT teams - Focus on standards and infrastructure updates. Quiet changes in Bluetooth, LoRaWAN, or edge stacks tend to show up months later as better battery life, lower BOM pressure, or simpler architectures.

  • Operators and service owners - Track anything that improves lifecycle economics. Fewer moving parts, clearer upgrade paths, and more deployable edge AI directly affect uptime, support cost, and service margins.

  • Strategists and investors - Read across items, not individually. When connectivity, compute, and platforms all mature at once, it usually marks an inflection point where new business models become viable.


The goal is not to follow every announcement, but to understand which shifts are becoming safe assumptions for next-generation connected products.


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