TheRoad

Smart Tangibles News Digest - Issue #2603 examines how Edge AI has moved from slideware to silicon. This Smart Tangibles News Digest covers Infineon’s PSoC Edge MCUs with built in AI and PSA Level 4 security, MediaTek’s domain specific IoT platform for smart retail, Silicon Labs’ push into AI enabled meters and electronic shelf labels, fresh forecasts putting edge AI on an 8x growth path, and a 2026 Matter status review that shows real progress - and lingering platform fricti

Digital twins, edge AI, sensor-as-a-service, AI-ready MCUs, and software-defined buildings. This week’s Smart Tangibles Digest maps the key shifts shaping next-generation connected products.